Beverly Asoo, graduate student, UCSB; bevasoo@engineering.ucsb.edu

Igor Altenberger

K. Badrinarayanan, Engineer, Cypress Semiconductor, San Jose, CA; bdk@cypress.com

Guive Balooch, Ph.D.

Monica Barney

Sabine Bechtle, Hamburg University of Technology

Terrence Becker , Research Analyst, Salomon Smith Barney, New York, NY, Tel: 415-617-8546

Chris Bencher, Staff Scientist, Applied Materials Inc., Santa Clara, CA

Brad Boyce, Sandia National Laboratories, P.O. Box 5800, MS 0889, Albuquerque, NM 87185-0889 (Tel:505-845-7525); blboyce@sandia.gov

Chiara Bosi , cbosi@ing.unife.it

R.M. Cannon, Ph.D., deceased

Da Chen; da_chen@hotmail.com  deceased

Don Bloyer, Seagate Technologies, Bloomington, MN; don_r_bloyer@notes.seagate.com

Aindrea McKelvey Campbell , Materials Science Department, Ford Research Laboratory, Dearborn, MI (Tel:313-594-7398); acampb24@ford.com

Josh Campbell , Metal Fabricating Division, General Motors, Troy, MI (Tel:483-610-116); josh.campbell@gm.com

Jim Card

Heeman Choe, Beker Hughes, Heeman.Choe@hugheschris.com

Mike Ciavarella; M.Ciavarella@soton.ac.uk

W. Craig Carter, Professor of Materials Science, MIT; wcraig@pruffle.nist.gov

Reiner Dauskardt, Assoc. Prof. of Materials Science, Stanford University; dauskardt@stanford.edu

V. B. Dutta, Advenient Technology, CA

Larry Edelson

James W. Foulk III

R. Fuquen-Molano, Timken Company, Canton, OH

Yong Gao 

Thomas George, JPL

Christopher J. Gilbert, McKensey & Co., Inc., New York (Tel:212-242-4155); Chris_Gilbert@McKinsey.com

Inhoy Gu, Professor of Applied Mechanics, Chung-Ang University, Korea; ihgu@chungang.edu

Hamid N. Hashemi, Prof. Mechanical Engineering, Northeastern University; hamid@coe.neu.edu

Fred Haubensak, Staff Scientist, Intel Corporation

Rebecca Havens

H. F. Hayashigatani

Mark Hoffman, Ass. Prof., Mater. Sci., University of NSW, Australia; Mark.Hoffman@unsw.edu.au

Moon-Hee Hong, Agency for Defense Development, Yuseong, Korea; mhhong@sunam.kreonet.re.kr

Valentina Imbeni, Ph.D.

Avinash Kant, Rockwell Semiconductor Systems, Newport Beach; avinash.kant@rss.rockwell.com

Tony Keslinke

Do Kyung Kim, Ph.D.

Kurt Koester, Ph.D.

Desi Kovar, Ass. Professor of Ceramics, University of Texas in Austin; dkovar@mail.utexas.edu

Jamie J. Kruzic, Ph.D. , Department of Mechanical Engineering, 204 Rogers Hall, Oregon State University, Corvallis, OR 97331-6001, Tel. 541-737-7027, email: kruzicj@engr.orst.edu

Scott Lillibridge

Tsann Lin

Julian M. Lippmann

Ellis Liu

Jim Mason, Ass. Prof. Aero. & Mech.Eng. University of Notre Dame; James.J.Mason.12@nd.edu

Ankur Mohan, Standford University; amohan@leland.stanford.edu

Angela Meyer, Exponent (Failure Analysis Associates), Menlo Park, CA

J. Finis McCarver, Consultant, Applied Technical Services, Atlanta; ats@atslab.com

Rich McClaughry, General Motors, Flint, MI

James McNaney, Lawrence Livermore National Laboratory, CA (Tel: (925)423-9335); mcnaney1@llnl.gov

John C. McNulty, Assistant Research Engineer, UCSB (Tel: (805)893-4341); johnm@engineering.ucsb.edu

C. M. Moss

Chris Muhlstein  The Pennsylvania State University, Department of Materials Science and Engineering, 310 Steidle Building, University Park, PA 16802. phone: 814-865-1523; fax: 814-865-2917; email: muhlstein@matse.psu.edu

Laxman Murugesh, Staff Scientist, Applied Materials Inc., Santa Clara, CA
 
Ravi Nalla, Ph.D. ,  Intel

Rachel Neuendorf

Tae-Sung Oh, Professor of Materials Science, Hong Ik University, Seoul, Korea;

Raj Pendse

Jan O. Peters, Technical University Hamburg-Harburg, Hamburg, Germany (Tel: 49-(40)42878-2617);j.o.peters@tu-harburg.de

R. N. Petrany, Colorstrip, Inc., Richmond, CA

Mark Ritter, Instron Corporation, Canton, MA

Scott Robertson, Cordis Corporation, Fremont, CA

Olaf Roder; olaf.roder@muc.mtu.dasa.de

A. Sakaida, Ass. Prof. Mech. Eng., Akaski College of Technology, Kyoto, Japan

Valeska Schroeder, Hardware Design Engineer, Hewlett-Packard Company, Palo Alto, CA (Tel: (650)857-4795); valeska_schroeder2@hp.com

Jianku Shang, Assoc. Prof. of Materials Science, Univ. Illinois-Urbana; j-shang@staff.uiuc.edu

Toshihiro Shimizu, Ph.D., visiting scholar

Kiyoshi Shirato

Jessica Stankiewicz

Chang Min Suh, Prof. Mech, Eng., Kyungpook National University, Taegu, Korea

Subra Suresh, R.P. Simmons Professor of Materials Science, MIT; ssuresh@mit.gov

Tohru Suzuki, National Institute for Materials Science, Materials Engineering Laboratory, Intelligent Materials Research Group, 1-2-1 Sengen, Tsukuba, Ibaraki 305-0047, Japan (Tel: +81-298-59-2459, Fax: +81-298-59-2401) SUZUKI.Tohru@nims.go.jp

Raj Thankappan

A.W. Thompson, Ph.D

John Toplosky

Ronan Le Toquin , University of Rennes, France; letoquin_r@yahoo.com

Hiroshi Tsuda, Nat. Inst. Mater. Chem. Res., AIST, MITI, Tsukuba, Japan; tsuda@nimc.go.jp

J.-L. Tzou

K. T. Venkateswara Rao, Manager R&D, Guidant Corp; krao@guidant.com

Malcolm Ward-Close; DERA, UK

Brandon Yoe, R&D Engineer, Guidant Corp., (Tel:650-464-3851)

Gun Young Lee   Naval Research Laboratory, Code 6176 Bldg 207, 4555 Overlook Avenue SW, Washington, DC 20375-5320, Phone: (202) 767-5342; Fax: (202) 767-3321; Email: gunlee@ccs.nrl.navy.mil

Weikang Yu, deceased

Rong Yuan

Elliot Zaken

Alexander Ziegler , Lawrence Livermore National Laboratory, Tel: 925-422-8070, aziegler@llnl.gov

Gerry Zamiski, Metallurgical Consultant, Los Angeles